Alcatel Micro Machining Systems 67 Sharp Street Hingham, MA 02043 tel: 781-331-4200 fax: 781-331-4230 pat.byrnes@avp.aclcatel.com alcatelvacuumus.com Alcatel introduces New AMS 200 ICP system for Deep Oxide Etching in MEMS & MOEMS applications Alcatel Micro Machining Systems, a business unit within Alcatel Vacuum Technology, announces today a new version of its AMS 200 deep ICP plasma etching tool, specifically designed for deep oxide etching in MEMS applications. After the successful introduction of its AMS 200 SE (Silicon Etcher) "I-Speeder"- ultra high silicon etch rate tool in April last year, Alcatel now offers the AMS 200 DE (Dielectric Etch) System, a best-adapted hardware and process solution to meet the typical etch requirements of SiO2, Glass, Quartz and other glass-like materials. In order to deal with the unique issues that differs oxide etching from silicon etching, significant hardware configuration changes were made on the existing AMS200 silicon etching platform, while conserving the same very user-friendly access to the process chamber as well as its renowned extremely small footprint. The Alcatel AMS 200 series provide the superior plasma etch technology that meets the etch requirements of the existing and emerging microsystem applications.