Technical Program Committee Technical Program Chairman Roger T. Howe, University of California Berkeley, USA Americas Region Co-Chairman Thomas Kenny, Stanford University, USA Asia/Oceania Region Co-Chairman Kazuo Sato, University of Nagoya, JAPAN Europe/Africa Region Co-Chairman Gilles Delapierre, CEA-LETI, FRANCE Topic Specialists A. Berlin, Intel Corporation, USA K. Böhringer, University of Washington, USA C. J. Kim, University of California - Los Angeles, USA D. Liepmann, University of California - Berkeley, USA R. Maboudian, University of California - Berkeley, USA K. Markus, Cronos/JDS Uniphase , USA K. Turner, University of California - Santa Barbara, USA Americas Program Committee T. Kenny, Stanford University, USA, Chairman S. Arney, Lucent Technologies, USA A. Ayón, Sony Semiconductor, USA A. Berlin, Intel Corporation, USA K. Böhringer, University of Washington, USA R. Brennan, Agilent Laboratories, USA V. Bright, University of Colorado, USA M. DeBoer, Sandia National Labs, USA D. DeVoe, University of Maryland, USA A. Duwell, C. S. Draper Laboratory, USA B. Frazier, Georgia Technical University, USA J. Gilbert, Coventor, USA C.J. Kim, University of California Los Angeles, USA D. Liepmann, University of California Berkeley, USA A. Lal, Cornell University, USA G. Lin, University of California Irvine, USA L. Lin, University of California Berkeley, USA R. Maboudian, University of California Berkeley, USA K. Markus, Cronos/JDS Uniphase, USA K. Turner, University of California Santa Barbara, USA D. Wilson, University of Washington, USA Asia/Oceania Program Committee K. Sato, University of Nagoya JAPAN, Chairman P.-Z. Chang, National Taiwan University, TAIWAN Y. Cheng, Tsinghua University, P.R. CHINA K. Chun, Seoul National University, KOREA K. Hane, Tohoku University, JAPAN M. Ishida, Toyohashi University of Technology, JAPAN Y.-K. Kim, Seoul National University, KOREA S. Konishi, Ritsumeikan University, JAPAN D.-D. Lee, Kyongbook University, KOREA K. Maenaka, Himeji Institute of Technology, JAPAN T. Nakamoto, Tokyo Institute of Technology, JAPAN O. Oshiro, AIST, JAPAN R. Sawada, NTT Applied Electronics Laboratory, JAPAN S. Shoji, Waseda University, JAPAN K. Toko, Kyushu University, JAPAN Y.L. Wang, Shanghai Institute of Microsystem and Information Technology, P.R. CHINA M. Washizu, Kyoto University, JAPAN M. Wong, The Hong Kong University of Science & Technology, HONG KONG E. Yoon, KAIST, KOREA Europe/Africa Program Committee G. Delapierre, CEA-LETI, FRANCE, Chairman T. Akin, Middle East Technical University, TURKEY A. D'Amico, University of Tor Vergata-Roma, ITALY N. De Rooij, University of Neuchâtel, SWITZERLAND P. French, Delft University of Technology, THE NETHERLANDS R.S. Jachowicz, Warsaw University of Technology, POLAND N. Jaffrezic-Renault, Ecole Centrale de Lyon, FRANCE H. Jakobsen, Sensonor, NORWAY A. Manz, Imperial College, UNITED KINGDOM J. Ramon Morante, University of Barcelona, SPAIN R. Puers, Katholieke Universiteit Leuven, BELGIUM P. Ripka, Czech Technical University, CZECH REPUBLIC H. Sandmaier, HSG-IMIT, GERMANY H. Seidel, Conti Temic microelectronic GmbH, GERMANY G. Stemme, Royal Institute of Technology, SWEDEN J. Suski, Schlumberger, FRANCE A. Van den Berg, University of Twente, THE NETHERLANDS B. Vigna, STMicroelectronics, ITALY Y.G. Vlasov, St. Petersburg State University, RUSSIA G. Wachutka, Technical University of Munich, GERMANY