Paul Carey
MEMS & Sensors Industry Group
USA
Soomin Chung
MEMS & Sensors Industry Group
USA
Mark Ding
Shanghai Industrial µTech. Research Inst.
CHINA
Jungchul Lee
Korea Advanced Inst. of Science and Tech.
KOREA
Yang Bu
Hong Kong Univ. of Science and Technology
HONG KONG
Sila Deniz Calisgan
Northeastern University
USA
Gerardo Gonzalez-Cerdas
University of Freiburg
GERMANY
Tianyiyi He
National University of Singapore
SINGAPORE
Luis Iglesias Hernandez
Université de Bordeaux
FRANCE
Po-Han Huang
KTH Royal Institute of Technology
SWEDEN
Chris Larson
University of Southern California
USA
Taemin Lee
Korea Advanced Inst. of Science and Tech.
KOREA
Zhong-Wei Lin
National Tsing Hua University
TAIWAN
Xiyuan Liu
Technical University of Denmark
DENMARK
Anxin Luo
Southern University of Science and Tech.
CHINA
Mingyo Park
Georgia Institute of Technology
USA
Antea Risso
Northeastern University
USA
Andrea Vergara
Tohoku University
JAPAN
Mohammad Yasir Ghiasi
Technical University of Denmark
DENMARK
Yue Zheng
Georgia Institute of Technology
USA
Markus Graf
Karlsruhe University of Applied Sciences
GERMANY
Liwei Lin
University of California, Berkeley
USA
Beth Pruitt
University of California, Santa Barbara
USA