Transducers 2009 - Denver, Colorado, USA
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General Info
Executive Committee

Program Committee

Steering Committee

Previous Conferences



Technical Program Committee

Technical Program Chair
Martin SchmidtMassachusetts Institute of Technology, USA

Technical Program Vice Chairs
Long-Sheng FanNational Tsinghua University, TAIWAN
Göran StemmeRoyal Institute of Technology, SWEDEN

Executive Program Committee
Chong AhnUniversity of Cincinnati, USA
Karl BöhringerUniversity of Washington, USA
Siebe BouwstraMEMS TC, THE NETHERLANDS
Jong-Uk BuSenPlus, REPUBLIC OF KOREA
Young-Ho ChoKAIST, REPUBLIC OF KOREA
Long-Sheng FanNational Tsinghua University, TAIWAN
Weileun FangNational Tsinghua University, TAIWAN
Hiroyuki FujitaUniversity of Tokyo, JAPAN
Christofer HieroldETH Zürich, SWITZERLAND
Jack JudyUniversity of California at Los Angeles, USA
Jörg KutterTechnical University of Denmark, DENMARK
Laurie LocascioNational Institute of Standards and Technology (NIST), USA
Joan R. MoranteUniveristy of Barecelona, SPAIN
Clark T.-C NguyenUniversity of California, Berkeley, USA
Lina SarroDelft University of Technology, THE NETHERLANDS
Martin SchmidtMassachusetts Institute of Technology, USA
Helmut SeidelUniversity of Saarland, GERMANY
Shuichi ShojiWaseda University, JAPAN
Olav SolgaardStanford University, USA
Göran StemmeRoyal Institute of Technology (KTH), SWEDEN
Harrie A.C. TilmansIMEC, BELGIUM
Kimberly L. TurnerUniversity of California, Santa Barbara, USA
Man WongHong Kong University of Science & Technology, HONG KONG
Shanhong XiaChinese Academy of Sciences, CHINA

Technical Program Committee
Tayfun AkinMiddle East Technical University, Turkey
David ArnoldUniversity of Florida, USA
Rashid BashirUniversity of Illinois, Urbana-Champaign, USA
Anja BoisenTechnical University of Denmark, DENMARK
Juergen BruggerEcole Polytechnique Fédérale de Lausanne (EPFL), SWITZERLAND
Lionel BuchaillotUniversity of Lille, France
Rob CandlerBosch LLC, USA
Pei-Zen ChangNational Taiwan University, TAIWAN
Karen CheungUniversity of British Columbia, CANADA
Michel DespontIBM Research Laboratory, SWITZERLAND
Jens DucreeDublin City University, IRELAND
David ElataTechnion- Israel Institute of Technology, ISRAEL
Masayoshi EsashiTohoku University, JAPAN
Gary FedderCarnegie Mellon University, USA
Alissa FitzgeraldA.M. Fitzgerald & Associates, LLC, USA
Sami FranssilaHelsinki University of Technology, FINLAND
Luc FrechetteUniversité de Sherbrooke, CANADA
Paddy FrenchDelft University of Technology, NETHERLANDS
Han GardeniersUniversity of Twente, NETHERLANDS
Udo-Martin GómezRobert Bosch GmbH, GERMANY
Yael HaneinTel Aviv University, ISRAEL
Yi-Long HaoPeking University, CHINA
Gilbert HawkinsEastman Kodak Company, USA
Storrs HoenAgilent, USA
David HorsleyUniversity of California, Davis, USA
Michael HuffMEMS Exchange, USA
Qing-An HuangSoutheast University, CHINA
Mike JudyAnalog Devices, USA
CJ KimUniversity of California, Los Angeles, USA
Yongkweon KimSeoul National University, KOREA
Satoshi KonishiRitsumeikan University, JAPAN
Chee W. KwokUniversity of New South Wales, AUSTRALIA
Abraham LeeUniversity of California, Irvine, USA
Gwo-Bin LeeNational Cheng Kung University, TAIWAN
Luke LeeUniversity of California, Berkeley, USA
Yikuen LeeHong Kong University of Science and Technology, HONG KONG
Xinxin LiChinese Academy of Sciences, CHINA
Michel MaharbizUniversity of California, Berkeley, USA
Ellis MengUniversity of Southern California, USA
Jianmin MiaoNanyang Technological University, SINGAPORE
Wilfried MokwaRWTH Aachen, GERMANY
Hiroaki NakanishiShimadzu Corporation, JAPAN
Hyo-Jin NamLG Electronics, KOREA
Fredrik NikolajeffUppsala University, SWEDEN
Joachim OberhammerRoyal Institute of Technology, SWEDEN
Yongsoo OhSamsung Electro-Mechanics Corporation, KOREA
Wouter OlthuisUniversite of Twente, NETHERLANDS
Takahito OnoTohoku University, JAPAN
Je-Kyun ParkKorea Advanced Institute of Science and Technology, KOREA
Sumitha PennathurUniversity of California, Santa Barbara, USA
Beth PruittStanford University, USA
Robert PuersKatholieke Universiteit Leuven, BELGIUM
Kazuo SatoNagoya University, JAPAN
Kazuaki SawadaToyohashi University of Technology, JAPAN
Uwe SchnakenbergRWTH Aachen, Germany
Mark ShannonUniversity of Illinois, Urbana-Champaign, USA
Isao ShimoyamaUniversity of Tokyo, JAPAN
Andrei ShkelUniversity of California, Irvine, USA
Joe SimonsonSandia National Laboratories, USA
Yuji SuzukiUniversity of Tokyo, JAPAN
Richard SymsImperial College London, UK
Osamu TabataKyoto University, Japan
Joseph TalghaderUniversity of Minnesota, USA
Hiroshi ToshiyoshiUniversity of Tokyo, Japan
Michiel VellekoopVienna University of Technology, AUSTRIA
Sabeth VerpoorteUniversity of Groningen, NETHERLANDS
Joel VoldmanMassachusetts Institute of Technology, USA
Eric YeatmanImperial College London, UK
Jun-Bo YoonKorea Advanced Institute of Science and Technology, KOREA
Hans ZappeUniversity of Freiburg, GERMANY
Roland ZengerleUniversity of Freiburg-IMTEK, GERMANY
Zhaoying ZhouTsinghua University, CHINA


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