About » Program Committee

Executive Technical Program Committee
Farrokh Ayazi
Georgia Tech
USA

Nuria Barniol
Universitat Autonoma de Barcelona
SPAIN

Sarah Bedair
U.S. Army Research Laboratory
USA

Karl Bohringer
University of Washington
USA

Victor J. Cadarso
Monash University
AUSTRALIA

Michel Despont
CSEM SA
SWITZERLAND

Isabelle Dufour
University of Bordeaux
FRANCE

Amy Duwel
Draper, Inc.
USA

Guo-Hua Feng
National Chung Cheng University
TAIWAN

Alissa Fitzgerald
A.M. Fitzgerald & Associates, LLC
USA

Jongbaeg Kim
Yonsei University
KOREA

Jörg Kutter
University of Copenhagen
DENMARK

Franz Laermer
Robert Bosch GmbH
GERMANY

Andreu Llobera
Carl Zeiss Vision
GERMANY

Frank Niklaus
KTH Royal Institure of Technology
SWEDEN

Srinivas Tadigadapa
Northeastern University
USA

Kenichi Takahata
University of British Columbia
CANADA

Shuji Tanaka
Tohoku University
JAPAN

Niels Tas
University of Twente
NETHERLANDS

Wei Wang
Peking University
CHINA

Xiaohong Wang
Tsinghua University
CHINA

Man Wong
Hong Kong University of Science & Technology
HONG KONG

Yao-Joe Yang
National Taiwan University
TAIWAN

Eric Yeatman
Imperial College London
UK

Technical Program Committee
Azadeh Ansari
Georgia Institute of Technology
USA

David Arnold
University of Florida
USA

Istvan Barsony
Hungarian Academy of Sciences
HUNGARY

Philippe Basset
University of Paris-Est
FRANCE

Amar Basu
Wayne State University
USA

Holger Becker
microfludiic ChipShop GmbH
GERMANY

Christian Bergaud
CNRS
FRANCE

Sunil Bhave
Purdue University
USA

Rob Candler
University of California, Los Angeles
USA

Carlo Carraro
University of California, Berkeley
USA

Junseok Chae
Arizona State University
USA

Jenna Chan
General Technical Services, LLC
USA

Hengky Chandrahalim
US Air Force Institute of Technology
USA

Honglong Chang
Northwestern Polytechnical University
CHINA

Kevin Chau
Hong Kong University of Science and Technology
HONG KONG

Yu-Ting Cheng
National Chiao Tung University
TAIWAN

Mu Chiao
University of British Columbia
CANADA

Jungwook Choi
Yeungnam University
KOREA

Eugene Chow
PARC
USA

Todd Christenson
HT Micro
USA

Marina Cole
University of Warwick
UK

Elisabetta Comini
University of Brescia
ITALY

Jesus Corres
Public University of Navarre
SPAIN

Tianhong Cui
University of Minnesota
USA

Maria Lucia Curri
National Research Council
ITALY

Alfons Dehe
University of Freiburg/Hahn-Schickard-Gesellschaft
GERMANY

Shih-Kang Fan
National Taiwan University
TAIWAN

Philip Feng
Case Western Reserve University
USA

Max Fleischer
Siemens AG
GERMANY

Olivier Francais
ESIEE Paris
FRANCE

Luc Frechette
Universite de Sherbrooke
CANADA

Paddy French
University of Technology, Delft
NETHERLANDS

Gerald Gerlach
University of Technology, Dresden
GERMANY

Tanay Gosavi
Intel Corp
USA

Einar Halvorsen
University of South-Eastern Norway
NORWAY

Peter Hesketh
Georgia Institute of Technology
USA

Andreas Hierlemann
ETH Zurich
SWITZERLAND

Qing-An Huang
Southeast University
CHINA

Eiji Iwase
Waseda University
JAPAN

Bernhard Jakoby
Johannes Kepler University Linz
AUSTRIA

Ville Kaajakari
Murata Electronics
USA

Chris Keimel
Menlo Microsystems
USA

Nicole Kerness
Kionix
USA

Jochen Kieninger
University of Freiburg
GERMANY

Beomjoon Kim
University of Tokyo
JAPAN

Eun Kim
University of Southern California
USA

Gyu Man Kim
Kyungpook National University
KOREA

Jung Mu Kim
Chonbuk Naitonal University
KOREA

Roy Knechtel
X-FAB MEMS Foundry GmbH Erfurt
GERMANY

Satoshi Konishi
Ritsumeikan University
JAPAN

Michael Kraft
KU Leuven
BELGIUM

Chee Yee Kwok
UNSW Sydney
AUSTRALIA

Sunghoon Kwon
Seoul National University
KOREA

Christoph Langhammer
Chalmers University of Technology
SWEDEN

Bruno Le Pioufle
ENS Paris-Saclay
FRANCE

Chengkuo Lee
National University of Singapore
SINGAPORE

Joshua Lee
City University of Hong Kong
HONG KONG

Jungchul Lee
Korea Advanced Institute of Science and Tech.
KOREA

Yi-Kuen Lee
Hong Kong University of Science and Technology
HONG KONG

Elie Lefeuvre
University of Paris-Sud
FRANCE

Thierry Leichle
CNRS
FRANCE

Max Lemme
RWTH Aachen University / AMO GmbH
GERMANY

Fengyuan Li
NXP Semiconductors
USA

Sheng-Shian Li
National Tsing Hua University
TAIWAN

Zhihong Li
Peking University
CHINA

Che-Hsin Lin
National Sun Yat-sen University
TAIWAN

Chih-Ting Lin
National Taiwan University
TAIWAN

Yu-Cheng Lin
National Cheng Kung University
TAIWAN

Xinyu Liu
University of Toronto
CANADA

Yaoping Liu
Peking University
CHINA

Carol Livermore
Northeastern University
USA

Matti Mäntysalo
Tampere University of Tehnology
FINLAND

Santiago Marco
University of Barcelona
SPAIN

Massimo Mastrangeli
University of Technology, Delft
NETHERLANDS

Carlos Mastrangelo
University of Utah
USA

Edgar Jan Mehner
Chemnitz University of Technology
GERMANY

Jianmin Miao
Nanyang Technologial University
SINGAPORE

Faisal Mohd-Yasin
Griffith University
AUSTRALIA

Adrian Neild
Monash University
AUSTRALIA

Conor O'Mahony
Tyndall National Institute
IRELAND

Joachim Oberhammer
KTH Royal Institute of Technology
SWEDEN

Wouter Olthuis
University of Twente
NETHERLANDS

Takahito Ono
Tohoku University
JAPAN

Dinesh Pamunuwa
University of Bristol
UK

Jae-Hyoung Park
Dankook University
KOREA

Jungyul Park
Sogang University
KOREA

Woo-Tae Park
Seoul National University of Science and Tech.
KOREA

Joseph Potkay
VA Ann Arbor Healthcare System
USA

Siavash Pourkamali
University of Texas, Dallas
USA

Long Que
Iowa State University
USA

Mina Rais-Zadeh
NASA Jet Propulsion Laboratory
USA

Matteo Rinaldi
Northeastern University
USA

Pavel Ripka
Czech Technical University
CZECH REPUBLIC

Anna Rissanen
VTT
FINLAND

Philippe Robert
CEA-Leti
FRANCE

Cosmin Roman
ETH Zurich
SWITZERLAND

Christopher Roper
HRL Laboratories, LLC
USA

Andrea Rusconi Clerici
USound GmbH
AUSTRIA

Aman Russom
KTH Royal Institute of Technology
SWEDEN

Silvan Schmid
Technical University, Wien
AUSTRIA

Gabriele Schrag
Technical University, Munich
GERMANY

Debbie Senesky
Stanford University
USA

Vincent Senez
IEMN-CNRS
FRANCE

Peng Shao
NXP Semiconductors
USA

Pietro Siciliano
Institute for Microelectronics and Microsystems
ITALY

Tiina Sikanen
University of Helsinki
FINLAND

Nutapong Somjit
University of Leeds
UK

Logan Sorenson
HRL Laboratories, LLC
USA

Chip Spangler
Aspen Microsystems, LLC
USA

Göran Stemme
KTH Royal Institute of Technoogy
SWEDEN

Koji Sugano
Kobe University
JAPAN

Hong-Bo Sun
Tsinghua University
CHINA

Massood Tabib-Azar
University of Utah
USA

Roozbeh Tabrizian
University of Florida
USA

Madoka Takai
The University of Tokyo
JAPAN

Joey Talghader
University of Minnesota
USA

Kyohei Terao
Kagawa University
JAPAN

Roland Thewes
Technical University, Berlin
GERMANY

Alexander Trusov
Northrop Grumman
USA

Dimitris Tsoukalas
National Technical University of Athens
GREECE

Toshiyuki Tsuchiya
Kyoto University
JAPAN

Joost van Beek
NXP Semiconductors
NETHERLANDS

Alexey Vasiliev
National Research Center Kurchatov Institute
RUSSIA

Oscar Vazquez Mena
University of California, San Diego
USA

Michael Vellekoop
University of Bremen
GERMANY

Rafal Walczak
Wroclaw University of Science and Technology
POLAND

Fei Wang
Southern University of Science and Technology
CHINA

Zheyao Wang
Tsinghua University
CHINA

Carolyn White
A.M. Fitzgerald & Associates, LLC
USA

Remco Wiegerink
University of Twente
NETHERLANDS

Peter Woias
Albert-Ludwig-University Freiburg
GERMANY

Songmei Wu
Beijing Jiaotong University
CHINA

Wengang Wu
Peking University
CHINA

Hadi Yagubizade
ASML
NETHERLANDS

Levent Yobas
Hong Kong University of Science and Technology
HONG KONG

Ryuji Yokokawa
Kyoto University
JAPAN

Yong-Kyu Yoon
University of Florida
USA

Lianzhong Yu
Institute of Geology and Geophysics, CAS
CHINA

Kwang-Seok Yun
Sogang University
KOREA

Xiaosheng Zhang
University of Electronic Science and Tech. of China
CHINA

Haoshen Zhu
South China University of Technology
CHINA


Copyright 2018, All Rights Reserved, Transducers 2019 - EUROSENSORS XXXIII and interteq.com