We are excited to introduce a new platform for industry presentations embedded in the scientific program of the Conference. The Industry Sessions will be on Monday, Tuesday, and Wednesday during the conference, with four 12-minutes presentations per day. Sessions will be towards the end of the lunch break and before the beginning of the poster session. These sessions open the opportunity for companies and research institutes to present their activities on the industrial stage located in the exhibition hall, with the broadest possible interaction potential with conference attendees.
Monday, 24 June
Session Chair: Dave Monk, NXP, USA
Industrial Stage 1a
Title: MLA300 MASKLESS ALIGNER FOR INDUSTRIAL APPLICATION
Presenter: Theophane Besson, Project Manager MLA300
Affiliation:
Heidelberg Instruments
Time: 13:30 - 13:42
Show Description
Hide Description
Maskless Aligners have become the workhorse for UV lithography in many research facilities all over the world. The fast exposure speed, quick turn-around time, and high flexibility make them ideal tools for fast prototyping and low-volume production. High-throughput industrial applications on the other hand impose such demands on speed that even the fastest and most successful Maskless Aligner in the market, our MLA150, cannot fulfil them. That is why Heidelberg Instruments has developed a new concept for a high-speed industrial version of a Maskless Aligner - the MLA300. The main challenge is to build a system with the required throughput, fully automated, and at the same time keeping the costs reasonable. In this presentation we want to explain the technology behind this system, outline the target applications, and show the first exposure results.
Industrial Stage 1b
Title: YIELD IMPROVEMENT FOR MEMS MANUFACTURING BY ION BEAM TRIMMING
Presenter: Marcel Demmler, Sales Director
Affiliation:
scia Systems GmbH
Time: 13:45 - 13:57
Show Description
Hide Description
During the manufacturing of microelectronic devices, the performance of those devices might depend on the thickness or geometry of certain layers within that device. This could be for example the thickness of a silicon layer of a SOI wafer for a MEMS oscillator or maybe the thickness or resistivity of a thin metal layer for a thin film resistors. Any thickness variation on a 200 mm wafer could cause losses in manufacturing yield. This could be corrected by ion beam trimming. During the trimming process a focused broad ion beam moves in a meander-shaped pattern across the wafer surface. By altering the local dwell time it is possible to precisely adjust the material thickness. The beam with a typical diameter of 7 ... 15 mm ensures a sufficient lateral resolution and a high throughput. The application of ion beam trimming and latest results will be presented.
Industrial Stage 1c
Title: i-ROM MODELBUILDER - MAKING MEMS DESIGN EASY
Presenter: Dr. Jan Mehner, Managing Director
Affiliation:
i-ROM GmbH
Time: 14:00 - 14:12
Show Description
Hide Description
The i-ROM MODELBUILDER is a quantum leap in the design of sensors and actuators. Easy to use for experienced engineers and students in training. It supports the design and optimization of MEMS and provides interfaces to MATLAB SIMULINK and ANSYS. The target groups are engineers designing sensor products for automotive industry and consumers, as well as universities for academic teaching and research. Even complicated MEMS models with multiple mass bodies, complex suspensions springs and comb cells are defined in a very short time. MEMS models are assembled from parametric library elements, taking into account manufacturing tolerances and corner roundings. The mechanical behavior and electromechanical interactions can be analyzed in the time and frequency domain for component and system design. Characteristic values such as pull-in and hysteresis-release voltages, frequency shifts of modes and quadrature of yaw-rate sensors are obtained by simple and intuitive commands.
Industrial Stage 1d
Title: ACTUAL CHALLENGES IN THE DEVELOPMENT OF PHYSICAL, CHEMICAL AND BIOLOGICAL SENSORS
Presenter: Dr. Florian Krogmann
Affiliation:
Innovative Sensor Technology IST AG
Time: 14:15 - 14:27
Show Description
Hide Description
Customized projects face ever new challenges: space, disposables or industrial gases have unique demands of adaptions and testing requirements. Their fulfilment can only be achieved by close cooperation between customer and supplier and by providing flexible product platforms with production batches from a few up to a few million pieces. From the behaviour of a platinum sensor cycled 70,000 times between minus and plus 200°C over the stabilization of polymer humidity sensors for applications of -40°C dew point to capacitive patches sensitive to foam in bio-reactors, this talk reveals IST AG's latest results for physical, chemical and biological sensor-applications.
Tuesday, 25 June
Session Chair: Francois Dion, Teledyne DALSA, CANADA
Industrial Stage 2a
Title: INNOVATIONS IN RELEASE AND ANTISTICTION TECHNOLOGY FOR MEMS
Presenter: David Springer, Ph.D., Product Manager
Affiliation:
SPTS Technologies
Time: 13:30 - 13:42
Show Description
Hide Description
SPTS is the premier supplier of equipment for etch, CVD and PVD for MEMS manufacturing and R&D. The Release Etch Division provides three processes essential to MEMS innovation: VHF for etching sacrificial SiO2, Xenon Difluoride for etching sacrificial Si, and MVD (Molecular Vapor Deposition) for anti-stiction, bio functionalization and other thin highly conformal films. This talk will give an overview on how these three process technologies are driving MEMS technical innovation, enabling higher aspect ratios, thinner more responsive devices, and greater process flexibility to enable the next generation of MEMS devices.
Industrial Stage 2b
Title: BOSCH SEMICONDUCTORS - SHAPING THE FUTURE WITH INNOVATION
Presenter: Dr. Dirk Droste, Director ASIC Development Bosch Sensortec GmbH
Affiliation:
Robert Bosch Group
Time: 13:45 - 13:57
Show Description
Hide Description
Bosch is technology and market leader for automotive and consumer MEMS sensors and one of the biggest manufacturers worldwide for automotive application specific integrated circuits (ASICs). Our business activities are driven by megatrends like automated and electrified driving, smart sensing and the world of IoT. In Reutlingen and Dresden, we develop and manufacture innovative sensors and ASICs. Dresden will also be the home of our new 300mm wafer fab. We also offer development partnerships for MEMS technology and subsequent MEMS foundry services. Beside classic MEMS technologies for inertial and pressure sensing, environmental sensors, resonators and micromirrors, we have process know-how and equipment for most of all other MEMS techniques. Some examples are sputtered PZT technology, AlN as well as a gigantic variety of metals incl. NiFe, etc: For creative specialists and talented newcomers, we offer optimal conditions and opportunities to shape and push the future of sensor technology and semiconductors together with us!
Industrial Stage 2c
Title: ADVANCEMENT OF MEMS DESIGN TOOLS AND ITS APPLICATION FOR INDUSTRY CHALLENGES
Presenter: Dr. Abid Ali, Principal Scientist
Affiliation:
IntelliSense Software Corp
Time: 14:00 - 14:12
Show Description
Hide Description
In this talk, we highlighted the key features of IntelliSuite that help to optimize MEMS based sensor/actuator design without having to go through the costly procedure of fabrication, packaging. Beyond the Multiphysics Analysis of presently available tool in the market, IntelliSuite tools provide physical process simulation and design, layout design includes DRC (design rule check), material characteristics, Multiphysics based device performance, packaging and system analysis in one toolset. There is number of challenges in industry like: design/address nonlinear behavior of device, temperature drift on device/package systems performance, stress and gradient in multilayers and its impact in device performance, quadrature error and address in inertial system structure, key process control in tapered structure as in DRIE or corner compensation for wet etch, materials beyond silicon process such as III-V compound semiconductor ( e.g. InP ) and quartz wet etch precise control etc., IntelliSuite provides a comprehensive solution for these challenges. A few examples will be given in this talk on how IntelliSuite is applied for these cases.
Industrial Stage 2d
Title: 3D PRINTED MICRO SYSTEMS FOR SCIENCE AND INDUSTRY
Presenter: Dr. Jochen Zimmer, Sales Manager
Affiliation:
Nanoscribe GmbH
Time: 14:15 - 14:27
Show Description
Hide Description
Two-photon-polymerization can be used for the direct printing of complex micro- and mesoscale 3D parts. These can have sub-µm feature sizes, optical quality surfaces, and movable components. The technology allows to print onto pre-structured surfaces and assemblies, and thus it is a powerful tool for creating complex 3D micro systems. We will show recent examples from the fields of microfluidics, organ-on-chip, microrobotics, microoptics and photonic integration.
Wednesday, 26 June
Session Chair: Udo-Martin Gomez, Robert Bosch GmbH, GERMANY
Industrial Stage 3a
Title: INNOVATION, TOGETHER WE DO IT
Presenter: Dr. Niklaus Schneeberger, Head of Active Implants & Microsystems
Affiliation:
Helbling Technik Bern AG
Time: 13:30 - 13:42
Show Description
Hide Description
Helbling is an independent innovation partner and engineering service provider with business centers in Switzerland, Germany and the US. We are 400 engineers and scientists across most technical disciplines. We have no products, no technologies and no IP of our own such that we remain neutral, independent and free to find the best solutions for our clients.
Among other services we offer: Project and quality management, system engineering and requirement management, neutral technology selection, process and design specification, design development, modeling and optimization, system integration, hardware and software development, prototype realization, test and characterization, design transfer for manufacturing. Our quality management system for product development is certified compliant with ISO 9001 and ISO 13485.
Helbling - your exclusive, independent contract engineering partner for the development your MEMS based product. Come talk to us at our booth to find out how Helbling can improve your competitiveness with innovative technologies and products.
Industrial Stage 3b
Title: OPTICAL CHARACTERIZATION OF MEMS REAL-TIME DYNAMICS AND 3D TOPOGRAPHY
Presenter: Markus Heilig, Product Manager
Affiliation:
Polytec GmbH
Time: 13:45 - 13:57
Show Description
Hide Description
Instruments for analysis and 3D visualization of dynamic response and static shape are key for developing MEMS. They are indispensable for validating FE calculations, determining cross-talk effects and measuring surface deformation. The new Polytec MSA-600 Micro System Analyzer is designed to combine several measurement techniques into a convenient "All-in-One" solution for 3D motion analysis and surface metrology. This instrument delivers increased measurement flexibility and precision, adapting to the needs of today's and tomorrow's microstructures. When incorporated in the MEMS design and test cycle, the Micro System Analyzer provides precise 3D dynamic and static response data useful for increasing device performance. This reduces development and manufacturing costs by shortening design cycles, simplifying trouble shooting and improving yield.
Industrial Stage 3c
Title: CHARACTERIZATION, IMAGING AND QUALITY CONTROL OF (ULTRA)THIN-FILM MICRO-STRUCTED SAMPLES
Presenter: Dr. Christian Hoffmann, Application Specialist
Affiliation:
ACCURION GMBH
Time: 14:00 - 14:12
Show Description
Hide Description
Accurion specializes in precision equipment for thin film characterization and active vibration isolation. We present Imaging Ellipsometry as a technique allowing the precise measurement of optical properties and layer thicknesses down to 0.1 nm on structures with a lateral resolution down to 1 µm. An overview of current application fields (MEMS, biochips, polymers, 2D materials) will be shown. For quality control our referenced spectroscopic ellipsometer (RSE) will be introduced as a tool combining high speed (200 spectra per second) with the accuracy of an ellipsometric measurement. We will further provide a quick detour presenting the advantages of our active vibration isolation systems for small and large scale instrumentation regarding highest stability and accuracy of your measurement results.
Industrial Stage 3d
Title: ENABLING BETTER MEMS FROM CONCEPT TO HIGH VOLUME PRODUCTION
Presenter: Dr David Haynes, Senior Director, Customer Support Business Group
Affiliation:
Lam Research Corporation
Time: 14:15 - 14:27
Show Description
Hide Description
Faster time to market, improved device yield and increased productivity in high volume manufacturing are becoming increasingly critical requirements for MEMS manufacturers. Lam Research is unique in being able to support these requirements by offering a broad range of modelling and production proven process technologies
At the very start of the MEMS development process, Lam's Coventor team offers a unique and powerful platform for MEMS design, simulation, verification and process modeling. This platform addresses MEMS-specific engineering challenges such as multi-physics interactions, process variations, MEMS + IC behavior and interactions before committing to actual fabrication. In a few hours or days, they can model or simulate effects that would have taken months of building and testing in the fab.
Then, Lam can support the ramp of proven designs into high volume products by offering a range of MEMS specific deposition, etch and clean solutions that draw on our advanced CMOS fabrication capabilities to deliver best in class MEMS manufacturing performance.