We developed a proprietary MEMS-Casting™ Technology, which can be used as a substitution or supplementary of electroplating for thick metal deposition. We provide metal deposition service and equipment based on the MEMS-Casting™ Technology, which can be used for TSV/TGV filling in advanced packaging, MEMS devices (solenoid coils), Integrated Passive Device(IPD) or 3D Microwave components, etc.