PacTech - Packaging Technologies GmbH
Am Schlangenhorst 7-9
Nauen, 14641 GERMANY
phone: +49-3321-4495-100
info@pactech.de
www.pactech.de

Booth 42

PacTech is a provider of advanced wafer bumping, packaging & solder ball placement equipment. As an innovator in the area of Laser Assisted Solder Jetting and Laser Chip Bonding, PacTech provides high accuracy high speed high flexibility solder bonding solutions for semiconductors and additional electronic components, alongside with its unique turnkey solution for wafer level electroless plating including process, equipment & chemical supplies from a single source.